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Patent Searching and Data


Title:
POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/121949
Kind Code:
A1
Abstract:
Provided are: a polyimide resin composition comprising a polyimide resin and a crosslinking agent having at least two oxazolyl groups, the polyimide resin having a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A includes a structural unit (A-1) derived from a compound represented by formula (a-1), and the structural unit B includes a structural unit (B-1) derived from a compound represented by formula (b-1), a structural unit (B-2) derived from a compound represented by formula (b-2), and a structural unit (B-3) derived from a compound represented by formula (b-3); and a polyimide film obtained by crosslinking the polyimide resin in the polyimide resin composition by means of the crosslinking agent. (In formula (b-1), X is a single bond or a specific group, p is an integer of 0-2, m1 is an integer of 0-4, and m2 is an integer of 0-4; and in formula (b-2), R1-R4 are each independently a monovalent aliphatic group or a monovalent aromatic group, and Z1 and Z2 are each independently a divalent aliphatic group or a divalent aromatic group, and r is a positive integer.)

Inventors:
ABIKO YOHEI (JP)
SEKIGUCHI SHINJI (JP)
TAKADA TAKAFUMI (JP)
Application Number:
PCT/JP2019/047728
Publication Date:
June 18, 2020
Filing Date:
December 06, 2019
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08K5/353; C08L79/08
Foreign References:
JP2010209309A2010-09-24
JP2016222797A2016-12-28
KR20180106212A2018-10-01
JP2014524512A2014-09-22
Attorney, Agent or Firm:
HIRASAWA, Kenichi (JP)
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