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Patent Searching and Data


Title:
POLYIMIDE RESIN COMPOSITION, POLYIMIDE PRECURSOR COMPOSITION, VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2022/210109
Kind Code:
A1
Abstract:
A polyimide resin composition containing: a polyimide having a repeating unit represented by formula (1); and at least one compound selected from the group consisting of compounds represented by general formulas (2-1), (2-2), (2-3) and (2-4). (In the formulas, X1 is at least one tetravalent group having an aromatic ring or an alicyclic structure having a norbornane skeleton, X is a single bond, -NHCO-, -CONH-, -COO- or -OCO, R1 and R2 are hydrogen, a C1-6 alkyl group, a phenyl group, or a C1-6 aminoalkyl group, and R3 is a C1-6 alkyl group.)

Inventors:
ABIKO YOHEI (JP)
HATAKEYAMA TAKURO (JP)
ISHII KENTARO (JP)
MURAYA TAKAHIRO (JP)
Application Number:
PCT/JP2022/013207
Publication Date:
October 06, 2022
Filing Date:
March 22, 2022
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10; C08J5/18; C08K5/544; C08L79/08
Foreign References:
JP2015004062A2015-01-08
KR20210015315A2021-02-10
JP2001270988A2001-10-02
CN111961202A2020-11-20
CN111171567A2020-05-19
JP2014170080A2014-09-18
JP2016188367A2016-11-04
JP2020126260A2020-08-20
JP2020204012A2020-12-24
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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