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Patent Searching and Data


Title:
POLYIMIDE RESIN, POLYIMIDE VARNISH, AND POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2020/203264
Kind Code:
A1
Abstract:
Provided are: a polyimide resin capable of forming films excellent in terms of colorless transparency, optical isotropy, chemical resistance (e.g., acid resistance and alkali resistance), and toughness; and a polyimide varnish and a polyimide film each containing or comprising the polyimide resin. The polyimide resin comprises constituent units A derived from tetracarboxylic dianhydrides and constituent units B derived from diamines, wherein the constituent units A comprise a constituent unit (A-1) derived from the compound represented by formula (a-1) and a constituent unit (A-2) derived from the compound represented by formula (a-2) and the constituent units B comprise a constituent unit (B-1) derived from the compound represented by formula (b-1) and a constituent unit (B-2) derived from the compound represented by formula (b-2). The polyimide varnish and the polyimide film contain or comprise the polyimide resin.

Inventors:
HOSHINO SHUN (JP)
MURAYAMA TOMOHISA (JP)
ABIKO YOHEI (JP)
OKA HIROAKI (JP)
MITADERA JUN (JP)
Application Number:
PCT/JP2020/011765
Publication Date:
October 08, 2020
Filing Date:
March 17, 2020
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G73/10
Domestic Patent References:
WO2016158825A12016-10-06
WO2009116500A12009-09-24
Foreign References:
JP2008297360A2008-12-11
JP2008100979A2008-05-01
JP2018203906A2018-12-27
JP2003155342A2003-05-27
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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