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Title:
POLYPHENOL COMPOUND, FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
Document Type and Number:
WIPO Patent Application WO/2024/005194
Kind Code:
A1
Abstract:
A film-forming composition for lithography which contains a polyphenol compound represented by formula (1). (In formula (1), A, Ar1, Ar2, X, P1, P2, j, k, l1, and l2 are as defined in the specification.)

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Inventors:
IWASAKI ATSUKO (JP)
OMATSU TADASHI (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2023/024419
Publication Date:
January 04, 2024
Filing Date:
June 30, 2023
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
G03F7/11; C07C39/15; C07C69/21; G03F7/26
Domestic Patent References:
WO2009048262A22009-04-16
Foreign References:
KR20060027158A2006-03-27
JP2008065303A2008-03-21
JP5609882B22014-10-22
JP2002311594A2002-10-23
JP2008216530A2008-09-18
JPH05127375A1993-05-25
JPH03200251A1991-09-02
JP2004099570A2004-04-02
JPH08277235A1996-10-22
JPH03201467A1991-09-03
JP2014058633A2014-04-03
JP2007316282A2007-12-06
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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