PROCESS CHAMBER COMPONENTS HAVING TEXTURED INTERNAL SURFACES AND METHOD OF MANUFACTURE

Title:

PROCESS CHAMBER COMPONENTS HAVING TEXTURED INTERNAL SURFACES AND METHOD OF MANUFACTURE

Document Type and Number:

WIPO Patent Application WO2003003404

Kind Code:

A3

Abstract:

A domed enclosure wall for a plasma processing chamber is made from a dielectric material having a roughened surface with a roughness average of from about 150 to about 450 microinches. A plasma sprayed ceramic coating is applied on the roughened surface of the dielectric material. The plasma sprayed coating comprises a textured surface having a roughness with an average skewness that is a negative value. When the enclosure wall is used in a plasma processing chamber, sputtered material generated by a plasma formed in a plasma processing chamber has good adherence to the textured surface.

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Inventors:

LIN SHYH-NUNG
MENZIE MARK D
SOMMERS JOE F
CLAWSON DANIEL OWEN
MORI GLEN T
SHARP LOLITA L

Application Number:

PCT/US2002/020095

Publication Date:

May 08, 2003

Filing Date:

June 24, 2002

Export Citation:

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Assignee:

APPLIED MATERIALS INC (US)

International Classes:

H05H1/46; B01J19/08; C04B41/87; C23C16/44; C23F4/00; H01J37/32; H01L21/3065; H05H1/32; H05H1/42; (IPC1-7): H01J37/32

Foreign References:

EP0838838A2	1998-04-29
US5762748A	1998-06-09
DE19719133A1	1998-11-12
US20020086118A1	2002-07-04

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