Title:
PROCESSING METHOD, PROCESSING APPARATUS AND PROCESSING SYSTEM FOR SEMICONDUCTOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/016380
Kind Code:
A9
Abstract:
The present disclosure relates to the technical field of semiconductors, and relates to a processing method, processing apparatus and processing system for a semiconductor structure. The processing method of the present disclosure comprises: providing a semiconductor substrate; forming a photoresist layer on the semiconductor substrate, wherein the photoresist layer comprises an edge region and a middle region, which are distributed adjacent to each other, and the edge region comprises a bump; detecting position information of the bump, and determining a target etching region according to the position information, wherein the bump is located in the target etching region; and etching the photoresist layer located in the target etching region. The processing method of the present disclosure can reduce the maintenance cost of a device and improve the product yield. (FIG. 1)
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Inventors:
LIU JING (CN)
Application Number:
PCT/CN2022/109550
Publication Date:
March 07, 2024
Filing Date:
August 01, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G03F7/42; H01L21/67
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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