Title:
PRODUCTION METHOD FOR PLATED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/270504
Kind Code:
A1
Abstract:
Provided is a production method that is for a plated substrate and that comprises: an adhesive agent provision step for providing a photoreactive adhesive agent 2 to a surface of a substrate 1 made of glass or silicon; an irradiation step for irradiating the surface of the substrate 1 to which the photoreactive adhesive agent 2 has been provided, with light 4, to attach the photoreactive adhesive agent 2 to the surface of the substrate 1; a first washing step for removing, by washing, the photoreactive adhesive agent 2 that has not attached to the surface of the substrate 1 after the irradiation step; a catalyst addition step for adding a catalyst 6 that binds to the photoreactive adhesive agent 1 after the first washing step; a second washing step for removing, by washing, the catalyst 6 that has not bound to the photoreactive adhesive agent 2 after the catalyst addition step; and a plating step for disposing a conductive material 7 on the photoreactive adhesive agent 2 to which the catalyst 6 has been bound, by an electroless plating treatment, after the second washing step. With the production method for a plated substrate according to the present invention, it is possible to produce a plated substrate in which a plating is formed and tightly attached, with a sufficient peel strength, to a surface of a substrate made of glass or silicon without forming projections and recesses on the surface of the substrate.
More Like This:
Inventors:
SANG JING (JP)
HIRAHARA HIDETOSHI (JP)
MURAOKA HIROKI (JP)
HIRAHARA HIDETOSHI (JP)
MURAOKA HIROKI (JP)
Application Number:
PCT/JP2022/024721
Publication Date:
December 29, 2022
Filing Date:
June 21, 2022
Export Citation:
Assignee:
NATIONAL CORPORATION UNIV IWATE UNIV (JP)
International Classes:
C23C18/18
Domestic Patent References:
| WO2017169612A1 | 2017-10-05 |
Foreign References:
| JP2020143007A | 2020-09-10 | |||
| JP2009013463A | 2009-01-22 | |||
| JP2021055174A | 2021-04-08 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: