Title:
PROTECTIVE FILM FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/157772
Kind Code:
A1
Abstract:
Provided is a protective film forming composition for forming a protective film that protects, from wet etching, an inorganic film of a semiconductor substrate on the surface of which the inorganic film is formed, said composition containing a solvent and a polymer that has at least any among oxirane ring and an oxetane ring and that does not have an aromatic ring in the main chain thereof.
Inventors:
NISHITA TOKIO (JP)
KINOSHITA KAZUHIKO (JP)
KINOSHITA KAZUHIKO (JP)
Application Number:
PCT/JP2023/004629
Publication Date:
August 24, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; C08G59/02; C08G65/18; G03F7/26; G03F7/40
Domestic Patent References:
| WO2015030060A1 | 2015-03-05 | |||
| WO2016080217A1 | 2016-05-26 | |||
| WO2006115044A1 | 2006-11-02 |
Foreign References:
| JP2007140461A | 2007-06-07 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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