Title:
QUANTUM CHIP AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/188604
Kind Code:
A1
Abstract:
The present application discloses a quantum chip and a preparation method. The quantum chip comprises a basic substrate on which a signal transmission line is formed; and at least one insulation substrate located on the basic substrate. Quantum bits and through holes running through the insulation substrate are formed in the insulation substrate; metal members are formed in the through holes; two ends of each metal member are respectively electrically connected to the signal transmission line and the quantum bits, such that signal transmission between the signal transmission line and the quantum bits is implemented; complete quantum bit circuits located on different layers are formed, and a plurality of insulation substrates that are stacked are used for forming the quantum bits located on the insulation substrates of different layers, such that the quantum bits are expanded to reach an enough quantity. Such a method improves the integration level of the quantum chip.
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Inventors:
MA LIANGLIANG (CN)
LIU WENSHU (CN)
ZHENG JIE (CN)
WANG NIANCI (CN)
YOU BING (CN)
LIU WENSHU (CN)
ZHENG JIE (CN)
WANG NIANCI (CN)
YOU BING (CN)
Application Number:
PCT/CN2022/076501
Publication Date:
September 15, 2022
Filing Date:
February 16, 2022
Export Citation:
Assignee:
ORIGIN QUANTUM COMPUTING TECH CO LTD (CN)
International Classes:
H01L39/22; G06N10/00; H01L39/02; H01L39/04; H01L39/24
Foreign References:
| CN214378496U | 2021-10-08 | |||
| CN109891591A | 2019-06-14 | |||
| US20180013052A1 | 2018-01-11 | |||
| US20190006572A1 | 2019-01-03 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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