Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2021/111913
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a radiation-sensitive resin composition which gas good sensitivity with respect to exposure light and is capable of forming a resist pattern that has high water repellency and few defects; a method for forming a resist pattern; a polymer; and a compound which is applicable thereto. The present invention is a radiation-sensitive resin composition which contains: a first polymer having a structural unit that contains an acid dissociable group; a second polymer having a structural unit represented by formula (1); and a radiation-sensitive acid generator. In formula (1), A represents an oxygen atom or a sulfur atom; (m + n) is 2 or 3; m is 1 or 2; n is 1 or 2; X represents a single bond or a divalent organic group having from 1 to 20 carbon atoms; and R1 represents a monovalent organic group having a fluorine atom.
Inventors:
NEMOTO RYUICHI (JP)
TANAKA RYOTARO (JP)
FURUKAWA TAIICHI (JP)
NISHIKORI KATSUAKI (JP)
NAKASHIMA HIROMITSU (JP)
TANAKA RYOTARO (JP)
FURUKAWA TAIICHI (JP)
NISHIKORI KATSUAKI (JP)
NAKASHIMA HIROMITSU (JP)
Application Number:
PCT/JP2020/043493
Publication Date:
June 10, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C07D317/36; C07C69/734; C07C69/75; C07C69/753; C07C69/92; C07D307/00; C07D307/33; C07D333/78; C08F20/22; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| WO2019026549A1 | 2019-02-07 | |||
| WO2015012229A1 | 2015-01-29 |
Foreign References:
| JP2016126309A | 2016-07-11 | |||
| JP2015172120A | 2015-10-01 | |||
| JP2004123819A | 2004-04-22 | |||
| JP2004035865A | 2004-02-05 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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