REACTIVE HOT MELT ADHESIVE FORMULATION FOR JOINING STAMPED METAL AND PLASTIC PARTS

Title:

REACTIVE HOT MELT ADHESIVE FORMULATION FOR JOINING STAMPED METAL AND PLASTIC PARTS

Document Type and Number:

WIPO Patent Application WO2004085510

Kind Code:

B1

Abstract:

Reactive one-part hot melt epoxy adhesive formulations, and methods of using the same, are described. The formulations include at least one epoxy resin, at least one tackifier, and at least one latent curing agent, and exhibit relatively good thermal stability, high lap shear strength, high T-peel strength, and adhere to a wide range of substrates. The formulations are especially suitable for use in joining automotive components that are subjected to paint oven or electrodeposition oven treatment.

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Inventors:

KYE JIHONG (US)

Application Number:

PCT/US2004/008934

Publication Date:

November 25, 2004

Filing Date:

March 24, 2004

Export Citation:

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Assignee:

DOW GLOBAL TECHNOLOGIES INC (US)
KYE JIHONG (US)

International Classes:

C08G59/22; C08L71/00; C09J5/06; C09J163/00; C08L61/00; C08L63/00; C08L93/04; (IPC1-7): C08G59/18; C08L63/02; C09J163/02

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