Title:
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2004/085511
Kind Code:
A1
Abstract:
A resin composition for sealing a semiconductor, which comprises a phenol aralkyl type epoxy resin having a biphenylene skeleton (A), a phenol aralkyl resin having a phenylene skeleton or biphenylene skeleton (B), an inorganic filler (C) in an amount of 84 to 90 wt % and a curing accelerator (D), as main components, and further comprises a silane coupling agent (E) in an amount of 0.01 wt % to 1 wt % and an aromatic compound (F) having two or more hydroxyl groups bonded to adjacent carbon atoms in an aromatic ring in an amount of 0.01 wt % or more, the percentages being relative to the total amount of the resin composition. The resin composition exhibits improved flowability, without detriment to its curability.
Inventors:
UMENO KUNIHARU (JP)
UEDA SHIGEHISA (JP)
UEDA SHIGEHISA (JP)
Application Number:
PCT/JP2004/003105
Publication Date:
October 07, 2004
Filing Date:
March 10, 2004
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
UMENO KUNIHARU (JP)
UEDA SHIGEHISA (JP)
UMENO KUNIHARU (JP)
UEDA SHIGEHISA (JP)
International Classes:
C08G59/24; C08G59/32; C08L63/00; H01L23/29; C08L65/00; (IPC1-7): C08G59/24; H01L23/29
Foreign References:
| JP2003105056A | 2003-04-09 | |||
| JP2002322347A | 2002-11-08 | |||
| JP2001131390A | 2001-05-15 | |||
| JPH0329352A | 1991-02-07 | |||
| JPH01245014A | 1989-09-29 | |||
| JP2003292730A | 2003-10-15 | |||
| JPH0790052A | 1995-04-04 |
Attorney, Agent or Firm:
Hayami, Shinji (Ebisu-Nishi Shibuya-ku Tokyo, 21, JP)
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