Title:
RELEASE FILM FOR USE IN SEMICONDUCTOR SEALING, MARKING FILM FOR USE IN SEMICONDUCTOR SEALING, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/193877
Kind Code:
A1
Abstract:
This release film for use in semiconductor sealing includes a substrate, a release layer, and a colored layer having thermosetting properties in this order or includes a substrate, a release layer, and one or more functional layers in this order. The outermost layer of the functional layers contains a thermosetting resin.
Inventors:
SUZUKI MASAHIKO (JP)
KANEKO TOMOYO (JP)
ICHIKAWA JUNICHI (JP)
MORI SHUICHI (JP)
KANEKO TOMOYO (JP)
ICHIKAWA JUNICHI (JP)
MORI SHUICHI (JP)
Application Number:
PCT/JP2021/012740
Publication Date:
September 30, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; B29C33/68; H01L21/56; H01L23/31
Foreign References:
| JP2017124535A | 2017-07-20 | |||
| JPH04206651A | 1992-07-28 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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