Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/032820
Kind Code:
A1
Abstract:
Provided are: a resin composition including at least one resin selected from the group consisting of cyclized resins and precursors thereof, and a compound B, which has a ring opening-polymerizable group, also has at least one structure selected from the group consisting of urea bonds, urethane bonds, and amide bonds not included in cyclic structures, and additionally has a radical polymerizable group; a cured product obtained by curing the resin composition; a laminate including the cured product; a method for producing the cured product; a method for producing the laminate; a method for producing a semiconductor device that includes the method for producing the laminate; a semiconductor device including the cured product or the laminate; and a novel compound.
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Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2022/032119
Publication Date:
March 09, 2023
Filing Date:
August 25, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L79/04; B32B15/08; C07D303/16; C07D305/06; C07D307/33; C07D307/89; C07D317/36; C08F20/20; C08F20/34; C08F290/14; C08G73/06; C08G73/10; C08K5/10; C08L79/08; G03F7/027; G03F7/037; G03F7/20
Domestic Patent References:
| WO2019117082A1 | 2019-06-20 | |||
| WO2020196363A1 | 2020-10-01 |
Foreign References:
| JP2006193745A | 2006-07-27 | |||
| JP2005103793A | 2005-04-21 | |||
| CN113185544A | 2021-07-30 | |||
| JP2020152857A | 2020-09-24 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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