RESIN COMPOSITION AND RESIN GLUE SOLUTION CONTAINING SAME, PREPREG, LAMINATED BOARD, COPPER-CLAD PLATE AND PRINTED CIRCUIT BOARD

WIPO Patent Application WO/2022/120909

A1

A resin composition and a resin glue solution containing same, a prepreg, a laminated board, a copper-clad plate and a printed circuit board. The resin composition comprises the following components in percentage by weight: 10-50 wt% of polyolefin resin, 5-40 wt% of boron nitride filler, 5-40 wt% of ceramic filler, and 30-70 wt% of silicon dioxide. The ceramic filler comprises any one or a combination of at least two of calcium titanate, lithium titanate, potassium sodium titanate, strontium calcium titanate, calcium zirconate or magnesium zirconate. The resin composition has excellent comprehensive properties such as high thermal conductivity, high peel strength, and low dielectric loss, and can meet the performance requirements of high-frequency plates.

WO/2015/045450	RESIN COMPOSITION, CURED PRODUCT OBTAINED BY CURING SAME, AND OPTICAL ADHESIVE COMPRISING RESIN COMPOSITION
JP3650123	Biodegradable and / or compostable polymers made from conjugated diene such as isoprene and 2,3-dimethyl-1,3-butadiene
JPS5470349	CONDUCTIVE COMPOSITION

YIN WEIFENG (CN)
HUO CUI (CN)
LIU RUI (CN)
XU YONGJING (CN)
YAN SHANYIN (CN)

PCT/CN2020/136755

June 16, 2022

December 16, 2020

Click for automatic bibliography generation  

SHENGYI TECHNOLOGY CO LTD (CN)

C08L47/00; B32B15/20; B32B17/04; B32B27/20; C08J5/24; C08K3/24; C08K3/36; C08K3/38; C08K13/02; C08L53/02; C08L71/12; H05K1/05

CN110168670A	2019-08-23
CN107090065A	2017-08-25
CN106916293A	2017-07-04
JP2012077107A	2012-04-19

BEYOND ATTORNEYS AT LAW (CN)

View/Download PDF      PDF Help

Previous Patent: SELF-ASSEMBLED NANOPARTICLE CONTAINING GB PROTEIN OF EB VIRUS, AND PREPARATION METHOD THEREFOR AND U...

Next Patent: FERROELECTRIC MEMORY AND STORAGE DATA READING METHOD THEREOF