Title:
RESIN COMPOSITION FOR OPTICAL WAVEGUIDES, RESIN COMPOSITION FOR SUBSTRATE WITH OPTICAL WAVEGUIDE, RESIN FILM, CURED OBJECT, AND OPTICAL CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/219012
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a resin composition suitable for optical communication technologies. Another purpose is to provide a resin composition which can be used as the insulating resin of re-wiring layers for electronics and also as the clad resin of optical polymer waveguides and which is suitable for filling the gap between chips, chip boards, etc. in order to protect the wiring and to make it possible to produce highly integrated, energy-saving, multifunctional devices based on various package structures including co-packaged optics. The present inventors diligently made investigations and, as a result, have discovered that a composition comprising a photocurable resin and a bismaleimide compound is useful as a resin composition for optical waveguides, thereby completing the invention.
Inventors:
TSUBAMOTO MAI (JP)
SHIRAI KAZUTERU (JP)
YAMAMOTO KAZUYOSHI (JP)
HOZUMI YASUHIRO (JP)
TAKEDA MAO (JP)
SHIRAI KAZUTERU (JP)
YAMAMOTO KAZUYOSHI (JP)
HOZUMI YASUHIRO (JP)
TAKEDA MAO (JP)
Application Number:
PCT/JP2023/016847
Publication Date:
November 16, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G73/12; C08L79/08; G02B6/12
Domestic Patent References:
| WO2022097684A1 | 2022-05-12 |
Foreign References:
| JP2010164770A | 2010-07-29 |
Attorney, Agent or Firm:
SHIN-EI, P.C. (JP)
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