Title:
RESIN COMPOSITION FOR SIDE FILLING, SEMICONDUCTOR DEVICE, METHOD FOR REMOVING SIDE FILLING MATERIAL, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/215577
Kind Code:
A1
Abstract:
The present invention provides a resin composition for side filling, the resin composition being easily imparted with high UV curability even if partially interposed in a space between a mounting component and a base material of a semiconductor device by means of side filling, while enabling a side filling material formed therefrom to be easily imparted with excellent repairability. This resin composition for side filling is used for the production of a side filling material 4 which is interposed between a base material 2 and a peripheral edge part of a surface of a mounting component 3 that is surface-mounted on the base material 2, the surface facing the base material 2. This resin composition for side filling contains a cationically polymerizable component (A) and a cationic photopolymerization initiator (B). The cationically polymerizable component (A) contains at least one of an oxetane compound (A1) and an alicyclic epoxy compound (A2). The ratio of the sum of the amount of the oxetane compound (A1) and the amount of the alicyclic epoxy compound (A2) to the total amount of the cationically polymerizable component (A) is 70% by mass or more.
Inventors:
FUKAMOTO YUSUKE
YAMADA YASUSHI
YAMADA YASUSHI
Application Number:
PCT/JP2022/014998
Publication Date:
October 13, 2022
Filing Date:
March 28, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/29; C08K3/013; C08K5/42; C08L63/00; C08L71/00; H01L23/31
Domestic Patent References:
| WO2019098053A1 | 2019-05-23 | |||
| WO2021157472A1 | 2021-08-12 |
Foreign References:
| JP2015153765A | 2015-08-24 | |||
| JP2004273554A | 2004-09-30 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF: