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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/150979
Kind Code:
A1
Abstract:
The present invention relates to a resin composition which is characterized by containing (A) a cyclic olefin homopolymer that has a glass transition temperature of 101-160°C, (B) a fibrous conductive filler, and (C) at least one elastomer that is selected from the group consisting of olefin-based elastomers and styrene-based elastomers. This resin composition is also characterized in that the content of the elastomer (C) is 5-25 parts by mass relative to 100 parts by mass of the cyclic olefin homopolymer (A). The present invention is able to provide a resin composition which is capable of providing a molded body that has excellent mechanical strength, heat resistance, electrical conductivity and low-outgas properties.

Inventors:
SATO HIROMU (JP)
EBATA KATSUYOSHI (JP)
NIKAIDOH MASANORI (JP)
SUZUKI TSUTOMU (JP)
MIMURA HIROSHI (JP)
Application Number:
PCT/JP2013/059591
Publication Date:
October 10, 2013
Filing Date:
March 29, 2013
Export Citation:
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Assignee:
LION CORP (JP)
International Classes:
C08K7/02; C08L45/00; C08L65/00
Domestic Patent References:
WO2004029152A12004-04-08
Foreign References:
JP2011006534A2011-01-13
JP2005336335A2005-12-08
JPH07118465A1995-05-09
JP2003261688A2003-09-19
JP2010155930A2010-07-15
JP2000511582A2000-09-05
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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