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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/149209
Kind Code:
A1
Abstract:
The object of the present invention is to provide a resin composition, etc., from which a cured product having excellent insulation reliability under high temperature and high humidity environments can be obtained, even in the case of a large-sized and finely wired circuit board. A resin composition comprising (A) an epoxy resin and (B) an inorganic filler, which satisfies the relation ship 0.75

More Like This:
JPH0196227FIBER-REINFORCED VIBRATION-DAMPING COMPOSITE STRUCTURAL MATERIAL
Inventors:
SAKAUCHI HIROYUKI (JP)
IKEHIRA SHU (JP)
Application Number:
PCT/JP2023/001362
Publication Date:
August 10, 2023
Filing Date:
January 18, 2023
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
C08G59/00; C08F283/10; C08K3/013; C08L21/00; C08L63/00; H05K1/03
Foreign References:
JP2021161205A2021-10-11
JP2020138996A2020-09-03
JP2018002887A2018-01-11
JP2020075977A2020-05-21
JP2019044180A2019-03-22
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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