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Title:
UNDERFILL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/149210
Kind Code:
A1
Abstract:
Provided is an underfill material that enables filling time to be reduced and that makes it possible to obtain a cured product having excellent crack resistance. The underfill material contains, (A) an epoxy resin having two or more epoxy groups per molecule, (B) a compound having an ethylenically unsaturated group and a functional group that is able to react with the epoxy group of component (A), and (C) an inorganic filler.

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Inventors:
OGURA ICHIRO (JP)
OKAZAKI DAICHI (JP)
Application Number:
PCT/JP2023/001363
Publication Date:
August 10, 2023
Filing Date:
January 18, 2023
Export Citation:
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Assignee:
AJINOMOTO KK (JP)
International Classes:
H01L23/29; C08F290/06; C08G59/40; H01L23/31
Domestic Patent References:
WO2020195733A12020-10-01
Foreign References:
JP2021009936A2021-01-28
JP2016514738A2016-05-23
JP2013032522A2013-02-14
JP2004093816A2004-03-25
US8212353B12012-07-03
US20110230012A12011-09-22
JP2012142438A2012-07-26
JP2019218531A2019-12-26
JP2017160457A2017-09-14
JP2013189489A2013-09-26
JP2017117864A2017-06-29
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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