Title:
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING REACTION PRODUCT OF TRIFUNCTIONAL COMPOUND
Document Type and Number:
WIPO Patent Application WO/2022/075339
Kind Code:
A1
Abstract:
The present invention provides: a composition for forming a resist underlayer film that enables formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, which each use said resist underlayer film-forming composition. This resist underlayer film-forming composition contains a reaction product obtained from: a compound (A) that is dissolved in a solvent and that is represented by formula (1) (in formula (1), A represents an organic group including an aliphatic ring, an aromatic ring, or a heterocyclic ring); a compound (B) having two functional groups that are reactive with respect to an epoxy group; and a compound (C) having one functional group that is reactive with respect to an epoxy group.
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Inventors:
SHIMIZU SHOU (JP)
TAMURA MAMORU (JP)
TAMURA MAMORU (JP)
Application Number:
PCT/JP2021/036900
Publication Date:
April 14, 2022
Filing Date:
October 06, 2021
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08G59/14; G03F7/11; G03F7/26; H01L21/027
Domestic Patent References:
| WO2019151471A1 | 2019-08-08 |
Foreign References:
| JP2011527460A | 2011-10-27 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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