Title:
SEMICONDUCTOR CARRYING MEMBER AND SEMICONDUCTOR MOUNTING MEMBER
Document Type and Number:
WIPO Patent Application WO/2016/027600
Kind Code:
A1
Abstract:
Provided is a semiconductor carrying member having a semiconductor mounting member capable of exerting a strong grip force and hardly allowing a contamination to attach and remain on the semiconductor side. In addition, provided is a semiconductor mounting member capable of exerting a strong grip force and hardly allowing a contamination to attach and remain on the semiconductor side.
The semiconductor carrying member of the present invention has a carrying substrate and a semiconductor mounting member, wherein the semiconductor mounting member includes a fibrous columnar structure and the fibrous columnar structure is equipped with a plurality of fibrous columnar objects. The fibrous columnar objects are oriented in a substantially vertical direction with respect to the carrying substrate, and the surface of the fibrous columnar structure on the opposite side to the carrying substrate has a static friction coefficient of 2.0 or more to a silicon wafer mirror surface.
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Inventors:
MAENO YOUHEI (JP)
Application Number:
PCT/JP2015/070530
Publication Date:
February 25, 2016
Filing Date:
July 17, 2015
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/683; B82Y30/00; C01B31/02; H01L21/677
Domestic Patent References:
| WO2013090898A1 | 2013-06-20 | |||
| WO2011077785A1 | 2011-06-30 |
Foreign References:
| JP2014098107A | 2014-05-29 |
Other References:
HIROKI NAKANISHI ET AL.: "Capture System for Space Plane-Structure with High Friction Material", JAPAN SOCIETY OF MECHANICAL ENGINEERS CONFERENCE ON ROBOTICS AND MECHATRONICS 2013 KOEN RONBUNSHU, 21 May 2013 (2013-05-21), pages 1 - 4
Attorney, Agent or Firm:
MOMII, Takafumi (JP)
Takafumi Momii (JP)
Takafumi Momii (JP)
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