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Title:
METHOD FOR MANUFACTURING TARGET MATERIAL FOR CYLINDRICAL SPUTTERING TARGET AND CYLINDRICAL SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2016/027599
Kind Code:
A1
Abstract:
The method for manufacturing a target material for a cylindrical sputtering target according to an embodiment comprises an outer circumferential surface grinding step, an inner circumferential surface grinding step, and a finish-grinding step. In the outer circumferential surface grinding step, the outer circumferential surface of a ceramic sputtering target material is ground. In the inner circumferential surface grinding step, the inner circumferential surface of the sputtering target material is ground. In the finish-grinding step, in the outer circumferential grinding step and/or the inner circumferential grinding step, the sputtering target material is ground in two or more grinding directions.

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Inventors:
ISHIDA SHINTARO (JP)
Application Number:
PCT/JP2015/070427
Publication Date:
February 25, 2016
Filing Date:
July 16, 2015
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C23C14/34; B24B5/12; C04B35/00; C04B41/80
Foreign References:
JP2009030165A2009-02-12
JP2007231392A2007-09-13
JP2001131737A2001-05-15
JP2001026863A2001-01-30
JP2002322560A2002-11-08
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
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