Title:
SEMICONDUCTOR DEVICE, AND DESIGN METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2015/098379
Kind Code:
A1
Abstract:
This semiconductor device (10) has a heat source element (HSE) and a thermosensor element (TE) on a semiconductor chip (SCH). The profile of the heat source element (HSE) in plan view is recessed, and the depth (y1) of the recessed space (SP) is set to a size from 0.75 to 0.25 times that of the total length (y0). The center part (Tc) of the thermosensor element (TE) is situated in proximity to one side of a linking area (hse3), and is positioned in the space (SP) in such a way that length (y3) is shorter than length (x31a) and length (x31b). In so doing, heat source element temperature detection sensitivity and efficient positioning of the semiconductor elements can be achieved.
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Inventors:
IWATA KOTARO (JP)
TANAKA KUNIMASA (JP)
TANAKA KUNIMASA (JP)
Application Number:
PCT/JP2014/080706
Publication Date:
July 02, 2015
Filing Date:
November 20, 2014
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L21/822; H01L27/04
Foreign References:
| JP2001015655A | 2001-01-19 | |||
| JPS63229758A | 1988-09-26 | |||
| JPS63229757A | 1988-09-26 | |||
| JPS62229866A | 1987-10-08 | |||
| JPH08213441A | 1996-08-20 | |||
| JP2006344721A | 2006-12-21 | |||
| JP2011049273A | 2011-03-10 | |||
| JP2006332176A | 2006-12-07 | |||
| JP2011049272A | 2011-03-10 | |||
| JP2013004677A | 2013-01-07 | |||
| JP2011108751A | 2011-06-02 | |||
| JP2008172132A | 2008-07-24 | |||
| JPH01177087A | 1989-07-13 | |||
| JP2002108465A | 2002-04-10 |
Other References:
See also references of EP 3089206A4
Attorney, Agent or Firm:
SANO PATENT OFFICE (JP)
Patent business corporation Sano patent firm (JP)
Patent business corporation Sano patent firm (JP)
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