Title:
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/053932
Kind Code:
A1
Abstract:
The present invention provides a semiconductor device such that the quality of a pixel region can be improved, an electronic device equipped with the semiconductor device, and a method for manufacturing the semiconductor device. The semiconductor device is configured by laminating a first substrate whereon a pixel region is formed that includes a pixel with a photoelectric conversion unit, and a second substrate whereon a logic circuit is formed that processes a signal output from the pixel region. At least either a mark used in an exposure process during manufacturing of the semiconductor device or a mark used in an inspection process for the semiconductor device is formed in a first region located between the pixel region and a first scribe region which is a peripheral portion of the first substrate and/or in a second region located between a region of the second substrate corresponding to the pixel region and a second scribe region which is a peripheral portion of the second substrate.
Inventors:
IWAMOTO MASAKI (JP)
SONODA KOUHEI (JP)
SONODA KOUHEI (JP)
Application Number:
PCT/JP2020/026363
Publication Date:
March 25, 2021
Filing Date:
July 06, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G03F9/00; H01L27/146
Domestic Patent References:
| WO2014125969A1 | 2014-08-21 |
Foreign References:
| JP2002334974A | 2002-11-22 | |||
| JP2008289096A | 2008-11-27 | |||
| JP2003249640A | 2003-09-05 | |||
| JP2018195625A | 2018-12-06 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
Download PDF:
Previous Patent: PRINTING DEVICE, PRINTING METHOD, AND PROGRAM
Next Patent: PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING SAME
Next Patent: PIEZOELECTRIC ELEMENT AND METHOD FOR MANUFACTURING SAME