Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/007788
Kind Code:
A1
Abstract:
The present invention improves the packaging reliability of a semiconductor device. Provided is a semiconductor device comprising a package body that includes a semiconductor chip and multiple electrode pads arranged on a surface thereof, and multiple bump electrodes each of which is bonded to one of the multiple electrode pads. The multiple bump electrodes include core bump electrodes each of which includes a core and coreless bump electrodes none of which includes the core.

Inventors:
NISHIDA YUJI (JP)
YOKOYAMA KAZUTOSHI (JP)
Application Number:
PCT/JP2022/007442
Publication Date:
February 02, 2023
Filing Date:
February 24, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/12; H01L21/60
Foreign References:
JP2005252074A2005-09-15
JP2009070699A2009-04-02
JP2012033692A2012-02-16
JP2013236039A2013-11-21
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: RESONANCE DEVICE AND METHOD FOR MANUFACTURING SAME

Next Patent: INERTIAL MEASUREMENT UNIT, METHOD FOR OPERATING INERTIAL MEASUREMENT UNIT, IMAGING DEVICE, DISPLAY D...