Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/135959
Kind Code:
A1
Abstract:
The present invention pertains to a semiconductor device in which wiring is covered by a solder resist, wherein ion migration is prevented.　The semiconductor device is provided with first wiring and second wiring, and the solder resist. The first wiring and second wiring are wired so as to be adjacent to each other in this semiconductor device provided with the first wiring and second wiring, and the solder resist. Furthermore, the solder resist covers each of the first wiring and second wiring in the semiconductor device with a gap provided between the first wiring and second wiring.

More Like This:
JP3895206SHEET SUBSTRATE FOR OSCILLATOR AND METHOD FOR MANUFACTURING SURFACE MOUNTED CRYSTAL OSCILLATOR USING THE SAME
JP2009500820How to make an assembly and assembly
JPS5816551SEMICONDUCTOR DEVICE OF GLASS SEALED TYPE
Inventors:
FURUHASHI TAKAHISA (JP)
Application Number:
PCT/JP2022/043889
Publication Date:
July 20, 2023
Filing Date:
November 29, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/12; G01M99/00
Foreign References:
JP2016051834A2016-04-11
JP2008034472A2008-02-14
JP2018093129A2018-06-14
JP2003332483A2003-11-21
JP2005093652A2005-04-07
JP2009152317A2009-07-09
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: FREEZING APPARATUS

Next Patent: ULTRASONIC PHASED ARRAY INSPECTION DEVICE AND ULTRASONIC PHASED ARRAY INSPECTION METHOD USING SAME