Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR SYSTEM, MOVING BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117227
Kind Code:
A1
Abstract:
The present invention inhibits a semiconductor element from electrically short-circuiting with a cooler, and efficiently releases heat produced by the semiconductor element. A semiconductor device, provided with a laminate, a semiconductor element, and a cooler. The laminate is provided with a first electrical conductor layer, a first insulator layer, a second electrical conductor layer, a second insulator layer, and a third electrical conductor layer. The first electrical conductor layer, the first insulator layer, the second electrical conductor layer, the second insulator layer, and the third electrical conductor layer are laminated. The first insulator layer is positioned between the first electrical conductor layer and the second electrical conductor layer, and insulates the first electrical conductor layer from the second electrical conductor layer. The second insulator layer is positioned between the second electrical conductor layer and the third electrical conductor layer, and electrically insulates the third electrical conductor layer from the second electrical conductor layer. The semiconductor layer is mounted on the first electrical conductor layer. The cooler is connected to the third electrical conductor layer.

Inventors:
YOSHIMATSU NAOKI (JP)
Application Number:
PCT/JP2019/048964
Publication Date:
June 17, 2021
Filing Date:
December 13, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
WO2014091608A12014-06-19
Foreign References:
JP2015225918A2015-12-14
JP2010114257A2010-05-20
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Download PDF: