SEMICONDUCTOR DEVICE AND VEHICLE - FUJI ELECTRIC CO LTD

Title:

SEMICONDUCTOR DEVICE AND VEHICLE

Document Type and Number:

WIPO Patent Application WO/2022/215401

Kind Code:

A1

Abstract:

The present invention makes it possible to curb any decrease in cooling performance while ensuring rigidity and corrosion resistance.　A top plate (21) forms a rectangular shape in a plan view; a cooling region (21b), in which a plurality of heat-radiating fins (24f) are arranged, is set in the middle of the reverse surface of the top plate (21) in the longitudinal direction; and communicating regions (21c, 21d) are respectively set on either side of the cooling region (21b). A side wall (22) is connected in an annular manner to the reverse surface of the top plate (21) so as to include the cooling region (21b) and the communicating regions (21c, 21d). The thickness (T2) of the cooling region (21b) of the top plate (21) is thinner than the thickness (T1) of outer margin regions (21e, 21f) to the outside from the side wall (22) of the top plate (21). Therefore, the distance from the front surface of the cooling region (21b) of the top plate (21) to the plurality of heat-radiating fins (24f) is short. The heat of a semiconductor module (10) is more readily conducted to the plurality of heat-radiating fins (24f), thus improving the cooling capability from refrigerant.

Inventors:

KOYAMA TAKAHIRO (JP)
YOSHIDA DAIKI (JP)
HINATA YUICHIRO (JP)
YAMADA TAKAFUMI (JP)
TATEISHI YOSHIHIRO (JP)

Application Number:

PCT/JP2022/009347

Publication Date:

October 13, 2022

Filing Date:

March 04, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJI ELECTRIC CO LTD (JP)

International Classes:

H01L23/473; H01L25/07; H01L25/18

Foreign References:

JP2020092250A	2020-06-11
JP2014176892A	2014-09-25
JP2005079386A	2005-03-24
JP2010212577A	2010-09-24

Other References: