Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/113383
Kind Code:
A1
Abstract:
A semiconductor device comprises a first semiconductor substrate (CHP1) which has a control circuit for generating control signals for a circuit under control and transmitter circuits (Tx) for modulating the control signals and generating transmission signals; a second semiconductor substrate (CHP2) which has receiver circuits (Rx) for demodulating the transmission signals transmitted from the transmitter circuits (Tx) and reproducing the control signals, and drive circuits (Drv) for driving the circuit under control based on the control signals output from the receiver circuits (Rx), and is electrically insulated from the first semiconductor substrate (CHP1); an AC coupling element which is formed on the semiconductor substrates and AC couples the first semiconductor substrate (CHP1) and the second semiconductor substrate (CHP2); and a semiconductor package (20) which is loaded with the first semiconductor substrate (CHP1), the second semiconductor substrate (CHP2), and the AC coupling element. Thus, the circuit area and the mounting area can be restricted
Inventors:
KAERIYAMA SHUNICHI (JP)
Application Number:
PCT/JP2010/000983
Publication Date:
October 07, 2010
Filing Date:
February 17, 2010
Export Citation:
Assignee:
NEC CORP (JP)
KAERIYAMA SHUNICHI (JP)
KAERIYAMA SHUNICHI (JP)
International Classes:
H01F17/00; H01L21/822; H01L27/04; H04B5/02; H04L25/02
Domestic Patent References:
| WO2009035028A1 | 2009-03-19 |
Foreign References:
| JP2007252109A | 2007-09-27 | |||
| JPH0510274A | 1993-01-19 |
Attorney, Agent or Firm:
IEIRI, Takeshi (JP)
家入健 (JP)
家入健 (JP)
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