Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/053867
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a more reliable semiconductor device. The semiconductor device of the present invention includes: a semiconductor substrate having a first main surface and a second main surface facing each other; a dielectric layer laminated on the first main surface of the semiconductor substrate; a first electrode layer laminated on the dielectric layer; and a protective layer provided to cover at least the outer peripheral edges of the dielectric layer and the first electrode layer and expose the outer peripheral edges of the first main surface of the semiconductor substrate, wherein the semiconductor substrate has high-resistance regions located at least immediately underneath the outer peripheral edges of the protective layer.
Inventors:
ASHIMINE TOMOYUKI (JP)
IRIE YUJI (JP)
MURASE YASUHIRO (JP)
IRIE YUJI (JP)
MURASE YASUHIRO (JP)
Application Number:
PCT/JP2020/016965
Publication Date:
March 25, 2021
Filing Date:
April 17, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/33; H01L27/04; H01G17/00
Domestic Patent References:
| WO2018211919A1 | 2018-11-22 | |||
| WO2019021817A1 | 2019-01-31 | |||
| WO2017145515A1 | 2017-08-31 |
Foreign References:
| JP2010206108A | 2010-09-16 | |||
| JP2004214589A | 2004-07-29 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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