Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/244629
Kind Code:
A1
Abstract:
This semiconductor device is provided with a first semiconductor element, a first article, a sealing resin and a cover part. The first semiconductor element comprises a first electrode. The first article has a first surface that faces the first electrode. The sealing resin covers the first semiconductor element and the first article. The cover part is interposed between the first electrode and the first surface, while containing a material that has a higher thermal conductivity than the sealing resin.
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Inventors:
FUTAMURA YOSUI (JP)
MIKAMI SHUNYA (JP)
KIMURA RYUTA (JP)
KUMAGAI KAZUHISA (JP)
MIKAMI SHUNYA (JP)
KIMURA RYUTA (JP)
KUMAGAI KAZUHISA (JP)
Application Number:
PCT/JP2022/019611
Publication Date:
November 24, 2022
Filing Date:
May 09, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/36; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| JP2019169610A | 2019-10-03 | |||
| JP2019125708A | 2019-07-25 | |||
| JP2006216776A | 2006-08-17 | |||
| JP2015103649A | 2015-06-04 | |||
| JP2004221568A | 2004-08-05 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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