SEMICONDUCTOR WAFER

WIPO Patent Application WO/2020/179184

A1

The present description provides a technology by which it is possible to reliably detect a marker such as an orientation flat or a notch. This semiconductor wafer is transparent or semitransparent. An inclined surface is provided between a first principal surface and a side surface of the semiconductor wafer. The angle between a reference plane, in which the principal surface extends toward the inclined surface, and the inclined surface is sin-1 (1/Nw) or more (Nw is the refractive index of the semiconductor wafer). When light is emitted from a direction perpendicular to a second principal surface, the incident light is totally reflected by the inclined surface. When the semiconductor wafer is photographed from the side of the inclined surface, a region corresponding to the inclined surface appears as a shadow, and thus the marker can be reliably detected.

WO/2003/065426	SEMICONDUCTOR WAFER MANUFACTURING METHOD, SEMICONDUCTOR WAFER MANUFACTURING ORDER ACCEPTANCE METHOD, AND SEMICONDUCTOR WAFER MANUFACTURING ORDER ACCEPTANCE SYSTEM
WO/2014/015592	SENSOR AND METHOD FOR MANUFACTURING SAME
JPH03295219	MANUFACTURE OF SEMICONDUCTOR DEVICE

MAEGAWA YOSUKE (JP)
NAKAHAMA KAZUHIKO (JP)
URAKAMI YASUSHI (JP)
WATANABE YUKIHIKO (JP)

PCT/JP2019/049227

September 10, 2020

December 16, 2019

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TOYOTA MOTOR CO LTD (JP)
DENSO CORP (JP)

H01L21/02; H01L21/304; H01L21/68

JP2017181390A	2017-10-05
JP2011047662A	2011-03-10

KAI-U PATENT LAW FIRM (JP)

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