SENSOR PACKAGE AND METHOD FOR PREPARING SAME

Title:

SENSOR PACKAGE AND METHOD FOR PREPARING SAME

Document Type and Number:

WIPO Patent Application WO/2017/135624

Kind Code:

A1

Abstract:

Disclosed are a sensor package and a method for preparing same. A sensor package, according to an embodiment of the present invention, comprises: a semiconductor chip comprising a sensor pattern which is externally exposed; a substrate comprising an accommodation part in which the semiconductor chip is accommodated; a sealant for integrally molding the semiconductor chip and substrate; through wiring vertically passing through the substrate; a wiring unit electrically interconnecting the semiconductor chip and through wiring and exposing the sensor pattern of the semiconductor chip; and an external connection unit electrically connected to the other side of the through wiring and electrically connectable to the outside.

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Inventors:

LEE EUNG JU (KR)
LIM SI WOO (KR)
OH DONG HOON (KR)

Application Number:

PCT/KR2017/000802

Publication Date:

August 10, 2017

Filing Date:

January 24, 2017

Export Citation:

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Assignee:

NEPES CO LTD (KR)

International Classes:

H01L25/07; H01L23/31; H01L23/48; H01L23/495; H01L23/522; H01L23/538; H01L25/11

Foreign References:

US20100327429A1	2010-12-30
KR20130132162A	2013-12-04
JP2001237337A	2001-08-31
KR20110076606A	2011-07-06
KR20140065723A	2014-05-30

Attorney, Agent or Firm:

SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)

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