SINTER, SPUTTERING TARGET AND MOLDING DIE, AND PRODUCTION PROCESS OF SINTER USING THE SAME

Title:

SINTER, SPUTTERING TARGET AND MOLDING DIE, AND PRODUCTION PROCESS OF SINTER USING THE SAME

Document Type and Number:

WIPO Patent Application WO/2006/082760

Kind Code:

A1

Abstract:

This invention provides a large sputtering target that is good in discharge properties during sputtering and properties of a thin film formed therefrom. There is also provided a production process of a sinter that can directly form a large molded product having an excellent accuracy of shape using a cold isostatic press without preforming and can produce a sinter, which can provide the above good sputtering target, at low lost with high efficiency. A sputtering target is produced using a sinter in which the content of carbon contained as an impurity has been brought to less than 0.005% by weight. The sinter is produced by molding a raw material powder directly by a cold isostatic press without adding an organic matter-containing binder and a molding aid and firing the molded product. The sinter can be produced by using a molding die having such a structure that, at the time of pressure compression, a filled raw material powder can be pressed only in a substantially monoaxial direction and, at the time of a reduction in pressure after the completion of pressing, the pressure can be released isotropically with respect to the molded product. Further, a large target in which the thickness of the erosion region has been increased can easily be produced at a high yield, contributing to improved usage of the target.

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Inventors:

ITOH KENICHI (JP)
MESUDA MASAMI (JP)
NAGAYAMA HITOSHI (JP)
SHIBUTAMI TETSUO (JP)
YATSUNAMI SHUNSUKE (JP)

Application Number:

PCT/JP2006/301357

Publication Date:

August 10, 2006

Filing Date:

January 27, 2006

Export Citation:

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Assignee:

TOSOH CORP (JP)
ITOH KENICHI (JP)
MESUDA MASAMI (JP)
NAGAYAMA HITOSHI (JP)
SHIBUTAMI TETSUO (JP)
YATSUNAMI SHUNSUKE (JP)

International Classes:

C23C14/34; B22F3/02; B28B3/00; C04B35/00

Foreign References:

JP2896233B2	1999-05-31
JP2003167324A	2003-06-13

Attorney, Agent or Firm:

Senmyo, Kenji (38 Kanda-Higashimatsushitacho, Chiyoda-k, Tokyo 42, JP)

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