Title:
SOLDER JOINT FAILURE SUPPRESSANT, FLUX, AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2021/200010
Kind Code:
A1
Abstract:
Provided are a solder joint failure suppressant, flux, and solder paste which can suppress the occurrence of joint failure. The flux of the present invention includes a base resin, activator, thixotropic agent, solvent, and solder joint failure suppressant, and the solder joint failure suppressant includes a compound represented by expression (11) below. In expression (11), R9 and R10 are each independently a saturated or unsaturated linear, branched, or cyclic alkyl group having 1-18 carbon atoms, and R11 and R12 may each independently be carboxy groups or R11 and R12 may be crosslinked to form a carboxylic acid anhydride group.
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Inventors:
NAGAI TOMOKO (JP)
TAKAGI KAZUYORI (JP)
ASAMI AI (JP)
TAKAGI YOSHINORI (JP)
TAKAGI KAZUYORI (JP)
ASAMI AI (JP)
TAKAGI YOSHINORI (JP)
Application Number:
PCT/JP2021/009755
Publication Date:
October 07, 2021
Filing Date:
March 11, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B23K35/363; C22C13/00
Foreign References:
| US4165244A | 1979-08-21 | |||
| JP2014054663A | 2014-03-27 | |||
| JPS5984842A | 1984-05-16 | |||
| JPS496022B1 | 1974-02-12 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
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