SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME

Title:

SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2023/166884

Kind Code:

A1

Abstract:

[Problem] To further improve photoelectric conversion efficiency. [Solution] This solid-state imaging device comprises: a semiconductor substrate that has a first surface as a light-receiving surface, and an irregular structure portion provided on the first surface; a photoelectric conversion section that is provided on the semiconductor substrate to generate charge corresponding to the amount of received light by photoelectric conversion; and a reflecting portion that is provided in the semiconductor substrate so as to extend substantially in parallel to the first surface to reflect the light that has passed through the first surface.

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Inventors:

YOSHIMOTO NAO (JP)

Application Number:

PCT/JP2023/002033

Publication Date:

September 07, 2023

Filing Date:

January 24, 2023

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H01L27/146; H01L31/10; H04N25/70

Domestic Patent References:

WO2021112098A1

2021-06-10

Foreign References:

JP2021090022A	2021-06-10
JP2021168316A	2021-10-21
JP2016009846A	2016-01-18

Attorney, Agent or Firm:

MIYAJIMA Manabu (JP)

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