Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/199597
Kind Code:
A1
Abstract:
A solid-state imaging device 1 is provided with a semiconductor substrate 20 having a major surface 20a on which a plurality of photosensitive regions 3 are provided, and an insulating film 30 provided on the major surface 20a of the semiconductor substrate 20. A plurality of irregularities R are formed on a surface (major surface 30b) of the insulating film 30 opposite to the major surface 20a of the semiconductor substrate 20, wherein the irregularities R have a plurality of height differences in the photosensitive regions 3.
Inventors:
KONO MAKOTO (JP)
SUZUKI YOSHIYUKI (JP)
OTA KEIICHI (JP)
ITO SHINYA (JP)
TAKIGUCHI RYO (JP)
SUZUKI YOSHIYUKI (JP)
OTA KEIICHI (JP)
ITO SHINYA (JP)
TAKIGUCHI RYO (JP)
Application Number:
PCT/JP2021/001819
Publication Date:
October 07, 2021
Filing Date:
January 20, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L27/144; H01L27/146; H04N5/369
Domestic Patent References:
| WO2018138851A1 | 2018-08-02 |
Foreign References:
| JPH06125068A | 1994-05-06 | |||
| JP2013093609A | 2013-05-16 | |||
| JP2010232494A | 2010-10-14 | |||
| JPH10144951A | 1998-05-29 | |||
| JP2007281324A | 2007-10-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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