Title:
SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053372
Kind Code:
A1
Abstract:
The present disclosure relates to a solid-state imaging element and a manufacturing method, and an electronic device that enable a higher image quality to be achieved. The solid-state imaging element comprises: a plurality of pixels; a capacitor that is provided to each pixel and that is configured to have a three-dimensional shape between upper wiring and lower wiring of a wiring layer of the pixel; and a separating part that electrically separates the capacitors of adjacent pixels. Further, the separating part is provided to each pixel so as to surround the capacitor. An interlayer insulating film is provided between the separating parts of the respective pixels. The present technology can be applied to CMOS image sensors, for example.
Inventors:
ISHIZAKI TAKESHI (JP)
Application Number:
PCT/JP2023/029937
Publication Date:
March 14, 2024
Filing Date:
August 21, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/822; H01L27/04
Domestic Patent References:
| WO2020261817A1 | 2020-12-30 |
Foreign References:
| JP2022045912A | 2022-03-22 | |||
| US7554788B2 | 2009-06-30 | |||
| JP2013153103A | 2013-08-08 | |||
| US20220052086A1 | 2022-02-17 | |||
| US20120306057A1 | 2012-12-06 | |||
| JP2020129795A | 2020-08-27 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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