SPUTTERING TARGET AND METHOD FOR GRINDING SPUTTERING TARGET

Title:

SPUTTERING TARGET AND METHOD FOR GRINDING SPUTTERING TARGET

Document Type and Number:

WIPO Patent Application WO/2001/034870

Kind Code:

A1

Abstract:

A sputtering target having a ground surface with no directionality having a surface roughness of Ra $m(F) 0.5 $g(m)m; and a method for grinding a sputtering target, characterized in that grinding is carried out by using a plane parallel to the rotation plane of a rotating unit, to thereby provide a ground surface with no directionality. The sputtering target can be used for preventing or reducing effectively the occurrence of cracking due to the warpage of a target itself, during transportation, mounting to a device and sputtering.

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Inventors:

ARIMA SHINICHI (JP)
ISHIZUKA KEIICHI (JP)

Application Number:

PCT/JP2000/005173

Publication Date:

May 17, 2001

Filing Date:

August 02, 2000

Export Citation:

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Assignee:

NIKKO MATERIALS CO LTD (JP)
ARIMA SHINICHI (JP)
ISHIZUKA KEIICHI (JP)

International Classes:

B24B39/06; C23C14/34; (IPC1-7): C23C14/34

Foreign References:

JPH10182151A	1998-07-07
JPH05214523A	1993-08-24
JPH10298743A	1998-11-10

Attorney, Agent or Firm:

Ogoshi, Isamu (7F 4-1, Nishi-Shimbashi 3-chome Minato-ku Tokyo, JP)

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