Title:
TACTILE SENSOR SHEET
Document Type and Number:
WIPO Patent Application WO/2021/199755
Kind Code:
A1
Abstract:
Provided is a technology for improving the performance of a tactile sensor sheet in which a plurality of tactile sensor chips are disposed on a flexible sheet. The present invention includes: a tactile sensor chip (10) that has a detection unit (12) provided on a chip (5) to detect a force, and a metal pad (11) for connecting the detection unit and an external circuit; and a flexible sheet (2). On one surface of the flexible sheet: electric wiring (7) that is connected to the metal pad is formed; the metal pad on the tactile sensor chip and the electric wiring are connected via a bump (4); resin (13) is provided on at least a part of the one surface of the sheet or the surface opposite the one surface; and at least a part of the sheet and/or tactile sensor chip is covered by the resin.
Inventors:
INOUE TADASHI (JP)
HORIMOTO YASUHIRO (JP)
HAMAGUCHI TSUYOSHI (JP)
HORIMOTO YASUHIRO (JP)
HAMAGUCHI TSUYOSHI (JP)
Application Number:
PCT/JP2021/005899
Publication Date:
October 07, 2021
Filing Date:
February 17, 2021
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
G01L5/00; B25J15/08; B25J19/02
Domestic Patent References:
| WO2018163263A1 | 2018-09-13 |
Foreign References:
| JPH0454422A | 1992-02-21 | |||
| JP2012088084A | 2012-05-10 | |||
| CN108534924A | 2018-09-14 | |||
| US20090145237A1 | 2009-06-11 |
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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