Title:
TEMPERATURE SENSOR ARRAY AND MOUNTING STRUCTURE THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/220540
Kind Code:
A1
Abstract:
Provided is a temperature sensor array including a plurality of temperature sensors which is easy to manufacture and with which it is possible to obtain sufficient temperature detection accuracy. This temperature sensor array includes a belt-like flexible substrate on which wiring is formed, and a plurality of temperature sensors, wherein the plurality of temperature sensors are disposed at different positions in the lengthwise direction of the belt-like flexible substrate and are connected to the wiring, and each of the plurality of temperature sensors has a layer extending across the width direction of the belt-like flexible substrate on the side opposite to the side facing the wiring.
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Inventors:
FUNAHASHI SHUICHI (JP)
KATO TADASHI (JP)
KATO TADASHI (JP)
Application Number:
PCT/JP2020/044351
Publication Date:
November 04, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01K7/16; G01K7/22
Domestic Patent References:
WO2019020220A1 | 2019-01-31 |
Foreign References:
US20160370210A1 | 2016-12-22 | |||
JP2007093453A | 2007-04-12 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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