Title:
TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD FOR PRODUCING THIN WAFER
Document Type and Number:
WIPO Patent Application WO/2021/220929
Kind Code:
A1
Abstract:
The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.
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Inventors:
MUTO MITSUO (JP)
SUGO MICHIHIRO (JP)
TAGAMI SHOHEI (JP)
SUGO MICHIHIRO (JP)
TAGAMI SHOHEI (JP)
Application Number:
PCT/JP2021/016272
Publication Date:
November 04, 2021
Filing Date:
April 22, 2021
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J5/00; C09J7/30; C09J11/08; C09J183/04; C09J183/05; C09J183/06; H01L21/304
Domestic Patent References:
| WO2017191815A1 | 2017-11-09 | |||
| WO2020050167A1 | 2020-03-12 |
Foreign References:
| JP2020029519A | 2020-02-27 | |||
| JP2014525953A | 2014-10-02 | |||
| JP2016119438A | 2016-06-30 | |||
| JP2009543708A | 2009-12-10 | |||
| JP2004064040A | 2004-02-26 | |||
| JP2006328104A | 2006-12-07 | |||
| US7541264B2 | 2009-06-02 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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