Title:
THERMAL REGULATORY MODULES USEFUL FOR COOLING ENERGY PACKS
Document Type and Number:
WIPO Patent Application WO/2022/155987
Kind Code:
A1
Abstract:
Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.
Inventors:
XIANG JING (CN)
LIM PAU YEE (MY)
XIE LAIYONG (CN)
LIM PAU YEE (MY)
XIE LAIYONG (CN)
Application Number:
PCT/CN2021/073918
Publication Date:
July 28, 2022
Filing Date:
January 27, 2021
Export Citation:
Assignee:
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD (CN)
International Classes:
H01M10/652; C09K5/06
Foreign References:
| CN103084215A | 2013-05-08 | |||
| CN103060592A | 2013-04-24 | |||
| CN1803965A | 2006-07-19 | |||
| CN110079277A | 2019-08-02 | |||
| CN102787508A | 2012-11-21 | |||
| US20030015811A1 | 2003-01-23 |
Attorney, Agent or Firm:
CHINA TRUER IP (CN)
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