Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING GAP FILLER USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/053760
Kind Code:
A1
Abstract:
The present invention addresses a problem of providing a thermally conductive silicone composition which has good storage stability, is capable of maintaining good adhesiveness to a substrate such as a heat emitting body or a heat dissipating body even under conditions of vibration, and which, due to having a high thermal conductivity, provides a thermally conductive member (gap filler) having excellent heat dissipation properties.　This thermally conductive silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a hydroxyl group-containing organopolysiloxane; (C) at least one selected from (C-1) an organic silicon compound which has two or more of at least one type of group selected from a methoxy group and an ethoxy group and which does not have a hydrocarbon group or a vinyl group having at least three carbons, and (C-2) a hydrolysate of the organic silicon compound (C1); (D) an addition catalyst; (E) a thermally conductive filler; and (F) a condensation catalyst.

More Like This:
JP3454095LIQUID, CURABLE COMPOSITION
JP6791672Thermally conductive polysiloxane composition
WO/2016/136245ORGANOPOLYSILOXANE, METHOD FOR PRODUCING SAME, AND CURABLE SILICONE COMPOSITION
Inventors:
TERASHITA NAZUNA (JP)
SAKAI KAZUYA (JP)
UCHIDA TAISHI (JP)
ASAKAWA YUKIHIKO (JP)
SUZUKI YUSUKE (JP)
NAKAMURA TAKASHI (JP)
Application Number:
PCT/JP2022/031105
Publication Date:
April 06, 2023
Filing Date:
August 17, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
WACKER ASAHIKASEI SILICONE CO LTD (JP)
International Classes:
C08L83/07; C08K3/01; C08K5/5435; C08L83/05; C09J11/02; C09J183/04; C09J183/05; C09J183/07
Domestic Patent References:
WO2021132345A12021-07-01
Foreign References:
JP2000095864A2000-04-04
JPH07305046A1995-11-21
JPH08225742A1996-09-03
JPH07304955A1995-11-21
JP2000086765A2000-03-28
JPH08170019A1996-07-02
JP2001348483A2001-12-18
JP2001139815A2001-05-22
JP2011153252A2011-08-11
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ALL-SOLID-STATE BATTERY AND METHOD FOR MANUFACTURING SAME

Next Patent: COUPLING DEVICE AND CLAMPING DEVICE