Title:
VIBRATION MONITORING DEVICE AND MACHINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/038750
Kind Code:
A1
Abstract:
Provided is a vibration monitoring device which minimizes oversight of abnormal vibration occurring during cutting and machining. The vibration monitoring device comprises an imaging device and a control device. The imaging device acquires image data by imaging workpieces and tools held by a machining device. The control device has a vibration determination unit and an image processing unit which performs image processing on the image data. The image processing unit extracts positions of the workpieces and tools in the image data. The vibration determination unit determines whether the vibrating state of the workpieces and tools is abnormal on the basis of the extracted positions of the workpieces and tools in the image data.
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Inventors:
JOROBATA YUKI (JP)
Application Number:
PCT/JP2023/027559
Publication Date:
February 22, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
B23Q17/24; B23B25/06; B23Q15/12; B23Q17/12
Domestic Patent References:
| WO2021029404A1 | 2021-02-18 |
Foreign References:
| JPH06155239A | 1994-06-03 | |||
| JP2018118359A | 2018-08-02 | |||
| JP2013132706A | 2013-07-08 | |||
| JP2012200858A | 2012-10-22 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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