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Patent Searching and Data


Title:
WIRE DISCHARGE MACHINING SYSTEM, WIRE DISCHARGE MACHINING METHOD, AND WORKPIECE MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/016984
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a wire discharge machining system in which a wire discharge processing machine and a robot can be efficiently associated. This wire discharge machining system 1 is provided with wire discharge processing machines 7, 11, 15 and a robot part 17 which loads a workpiece to the wire discharge processing machines. The wire discharge processing machines 7, 11, 15 perform either rough machining during which a core is maintained or finish machining performed after removing the core, wherein the core handling can be performed with a dedicated machine, or the core handling can be performed with one machine to perform both machining. The robot part 17 loads and unloads workpieces and allows these wire discharge processing machines to efficiently operate, whereby the efficiency of wire discharge machining is improved over the entire system.

Inventors:
MITSUYASU TAKASHI (JP)
ITO YOSHIHIRO (JP)
SAKATANI TAKAYASU (JP)
FUJII HIROAKI (JP)
Application Number:
PCT/JP2018/003316
Publication Date:
January 24, 2019
Filing Date:
January 31, 2018
Export Citation:
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Assignee:
SEIBU ELECTRIC & MACHINERY CO LTD (JP)
International Classes:
B23H7/02
Domestic Patent References:
WO2016132973A12016-08-25
WO2013187201A12013-12-19
Foreign References:
JPH02284822A1990-11-22
JP5913751B22016-04-27
JPH0780725A1995-03-28
JP2006289541A2006-10-26
JPS58160018A1983-09-22
JPH04171111A1992-06-18
JP2014159055A2014-09-04
JPH09220685A1997-08-26
Attorney, Agent or Firm:
HADATE Koji (JP)
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