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WO/1996/008336A1 |
A method for manufacturing metallic structures, in particular honeycombed bodies, especially for catalytic converters, from at least partially structured, wound up, intertwined or layered sheet metal layers, comprises the following steps...
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WO/1996/002351A1 |
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to...
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WO/1995/030508A1 |
The description relates to a process for soldering metal structures, especially honeycomb bodies for exhaust gas catalysts. Here, the solder is applied in powder form and bonded to the metal structure by a bonding agent acting as an adhe...
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WO/1995/020455A1 |
Two steel U-shaped half-section pipes (4, 5) are joined by a steel ribbed web (2) with rectangular folds. Soldering foil (23) is placed between the ridge regions (21, 22) of the ribbed web (2) and the outer surfaces (3) of the half secti...
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WO/1995/006541A1 |
A laser welder (10) is provided comprising an optical fiber (28), a wheel (26) including a slot for receiving an article to be welded, the optical fiber mounted to and wound upon the wheel (26) as the wheel is rotated to bring the fiber ...
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WO/1995/006538A1 |
This invention aims at providing a welded joint permitting welding with a bead of a small width, and a welding method. A welded joint having a tubular end to be welded, characterized in that a bevel is provided on an inner surface of the...
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WO/1995/004795A1 |
A low temperature carbonisation chamber (8) for waste (A) can rotate around its longitudinal axis (10) and contains a plurality of heating pipes (12) located in its inner space (13). These heating pipes (12) are secured at one end to a f...
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WO/1994/029065A1 |
A rail lamp device and an apparatus for flash welding of rail are used in connecting railway rails to one another by flash welding to form a long welded rail. Electrode blocks (8) are inserted into and mounted to recessed guide portions ...
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WO/1994/022628A1 |
A gas is introduced into a gas flow passage formed by a dielectric material, such as glass, and a ceramic material is gas-discharged by high-frequency discharge or non-polar discharge with microwaves. A member under an atmospheric pressu...
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WO/1994/006594A1 |
In a process for soldering partial areas (5) of a metallic structure (2, 4), a sticky material is applied on the partial areas (5) and then soldering powder is applied thereon, which adheres to the sticky material. The sticky material re...
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WO/1993/002829A1 |
The invention relates to a finned tube (1), a process for making it and a device for implementing the process. In the process, at least one endless strip (4) forming the fins is wound approximately helically about a rotating tube body (2...
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WO/1992/020488A1 |
An internal diameter (I.D.) welding machine (21), and rotary drive and feed unit (24) therefor, is mounted via temporary brackets (19, 20) on an excavator bucket (10), the bores (15, 16) of which are to be repaired (after line boring ove...
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WO/1992/003250A2 |
Laser perforation of all types of paper provides paper having sufficient strength characteristics to survive stresses imposed during handling, such as experienced in sheet feed processes. The paper so perforated is readily separable alon...
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WO/1991/016167A1 |
An automatic rail welding method wherein the welding at the bottom of a rail is conducted by uranami-welding first layer by a CO2 gas shield arc welding method; the welding at the second and subsequent layers is conducted continuously in...
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WO/1991/009700A1 |
An automatic welder is used in an internal welder unit (30) which travels along the interior of a pipeline and provides the interior weld passes at the junction of abutting pipe joints (32, 33). The internal welder unit (30) has an elect...
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WO/1991/007247A1 |
Disclosed is a method for making a solder joint without flux, in the presence of an inert gas. A pair of articles (10, 20) having solder-coated surfaces are heated to melt the solder, pressure is applied to the joint region, and the arti...
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WO/1991/006390A1 |
A horizontal solder leveller for applying solder to a board comprises: means (15u, 151; 16u, 161; 17u, 171) including a solder bath (1) for applying molten solder (2) to a board; means (47) for levelling solder applied to the board, incl...
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WO/1990/014181A1 |
A welding machine for manufacturing wire nets from mutually perpendicular longitudinal and transverse wires welded at the points of intersection comprises a device for feeding the longitudinal wires in a horizontal welding plane, two dev...
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WO/1990/010518A1 |
A method of soldering without the need for fluxing agents, high temperature, hydrogen, laser excitation or sputtering techniques. The method uses plasma excitation to remove surface oxides from solder surfaces, thereby eliminating the ne...
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WO/1990/009862A1 |
The machine is provided with a set of two pairs of die halves (60, 62) mounted in a framework on hydraulically actuated piston and cylinder assemblies. The die halves (60 and 62) of each pair are relatively radially reciprocable to grip ...
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WO/1989/001383A1 |
A composite metal panel (10), particularly for use in constructing railroad passenger cars, comprises a sheet metal outer component (11) resistance-welded to the lands, or ridges (15), of an underlying corrugated metal component (12). Al...
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WO/1984/002097A1 |
A method of attaching semiconductor die (12) to a package substrate (14) and a composition for such die-attach, which method and composition comprise the combination of a low and a high-melting powder (16, 18) with a vehicle (20) consist...
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JP5957824B2 |
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JP5946249B2 |
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JP5887754B2 |
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JP5793902B2 |
An electronic-component lead terminal includes a lead terminal one end of which is connectable to an electronic component and the other end of which is connectable to an electrode, and a solder-wicking prevention area formed on a surface...
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JP5710407B2 |
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JP5657874B2 |
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JP5641766B2 |
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JP5605423B2 |
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JP5604812B2 |
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JP5606102B2 |
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JP5601275B2 |
The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substr...
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JP5602421B2 |
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JP5602747B2 |
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JP5601342B2 |
A guide vane has a devised guide configuration for changing a flow direction of molten solder. The guide vane comprises a half-cylindrical plate 11 having a prescribed inner surface shape and a prescribed height, being stood on a prescri...
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JP2014184446A |
To provide a joint material capable of restraining a joint area shrinkage, while maintaining an advantage of zinc-aluminum (Zn-Al)-based solder as a non-lead-based high temperature solder.The laminate joint material on the present invent...
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JP5597518B2 |
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JP5600512B2 |
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JP2014183178A |
To provide a process of manufacturing a substrate capable of suppressing peeling of a conductive film formed on an inner wall surface of a through-hole through which one side of the substrate and the other side of a principal surface are...
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JP5596319B2 |
The present invention provides an apparatus (50) for the dry fluxing of at least one component and/or solder surface via electron attachment. The apparatus (50) generates a negatively charged ionic reducing gas and comprises: an enclosur...
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JP5593873B2 |
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JP5594324B2 |
In a bond portion between an electrical conductive land and a connection terminal member, an intermetallic compound producing region in which at least a Cu—Sn-based, an M-Sn-based (M indicates Ni and/or Mn), and a Cu-M-Sn-based interme...
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JP5593871B2 |
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JP2014172464A |
To provide a vehicle rear door structure that can secure degrees of freedom in design, reduce cost and weight, suppress deformation of a lamp installation portion and improve formability and yield, and to provide a manufacturing method f...
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JP2014172802A |
To provide a paste for joining a copper member capable, even in a case where a copper member is joined with a ceramic member, not only of inhibiting the cracking of the ceramic member without forming a thick and hard Ag-Cu eutectic textu...
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JP2014168798A |
To restrain accumulation to a cleaning liquid of Sn salt and re-sticking to a substrate, without using a special cleaning liquid, when cleaning and removing flux of solder in the substrate to which a component is soldered by the solder i...
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JP2014170187A |
To provide a sealing component which is high in airtightness, an optical device sealing structure, a method for manufacturing the sealing component and a method for manufacturing the optical device sealing structure.A sealing component 1...
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JP2014168791A |
To provide a flux film being a flux that exhibits a stable flux action, is excellent in formability of a solder joint, is excellent in workability and storage stability, and has a reduced load on the environment, a flip-chip connection m...
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JP5591560B2 |
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