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WO/2004/011190A1 |
A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.
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WO/2004/009279A1 |
When an aluminum product is preheated to about 500ºC in preheating furnace (6) before flux brazing of the aluminum product in a heating furnace, the heating time for brazing the aluminum product through heating the same in a continuous-...
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WO/2004/002673A1 |
The present invention provides seam-welded, air hardenable steel tubes (12), methods of manufacturing seam-welded air hardenable steel tubes (12), tube mills for practicing such methods and applications for using seam-welded, air hardena...
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WO/2004/000500A1 |
An apparatus for performing operations on at least one surface of an electronic substrate (10) having a first surface and a second surface includes a frame, a transportation system that moves the substrate (10) through the apparatus, a s...
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WO/2004/001827A1 |
A method for splitting along streets a semiconductor wafer the surface of which is sectioned into regions with circuit by streets arranged in a lattice form. This method comprises the step of detecting the streets from the rear of the se...
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WO/2003/106101A1 |
A plurality of parts are brazed using an iron/chromium brazing filler metal. The parts are preferably composed of stainless steel and the brazed assembly forms a heat exchanger characterized by good corrosion resistance and low rates of ...
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WO/2003/104563A1 |
Disclosed is a rail line comprising an element (12) of a railroad track unit, which is made of a high-alloy steel and in which at least one alloy has a content of at least 5 percent by mass, and a rail section (14) made of steel. Said el...
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WO/2003/101810A1 |
The invention relates to a lightweight construction element having an inner, light metal, framework structure and consisting of a plurality of extruded hollow profiles (1, 2, 3) which are interconnected in a plane configuration. Said lig...
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WO/2003/097292A1 |
A welding method for joining a plurality of members to each other by fusion welding capable of facilitating a welding treatment and increasing a joining strength, comprising the steps of allowing the joining portion (41) of the other mem...
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WO/2003/094584A1 |
The invention relates to a method for creating a trench structure with steep lateral walls, devoid of residue, in a substrate (1) that has in particular been reinforced with glass fibre. The substrate is provided with a conforming mask (...
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WO/2003/092949A1 |
An apparatus (10) for splicing a heatable section (20) of a tubular heater (12) to a cold section, (22) with the heatable section (20) having an outer sheath (78), which has a heating element (84) therein, while the cold section (22) has...
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WO/2003/090258A2 |
A substrate (30) is diced using a program-controlled pulsed laser beam (35) apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate &Dgr t, pulse energy densi...
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WO/2003/088725A1 |
A copper foil with carrier foil enabling perforating a surface of copper foil as an outer layer of copper clad laminate by carbon dioxide gas laser without any nickel auxiliary metal layer and organic material coating for increasing the ...
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WO/2003/086698A1 |
A method of manufacturing an annular body capable of making parallel the butted end faces (cut faces) of a blank material with each other when the blank material is rollingly formed and the faces thereof are butted against each other wit...
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WO/2003/082513A1 |
The present invention discloses an apparatus for fabricating cutting tools and wear-resistant components by automatically welding a blank to a shank. The automatic welding apparatus comprises: a rotating axis disposed in the center of a ...
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WO/2003/080324A1 |
A method in the manufacture of a web−shaped packaging laminate (22) comprising a core layer (24) of paper or paperboard, the method including the steps of coating (38) a first side of a material web (40) of paper or paperboard with an ...
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WO/2003/079743A2 |
The invention relates to a method for fitting out and soldering a circuit board which is fitted with a wired electric component with at least one connection wire or pin and a thermally critical housing for conventional automatic solderin...
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WO/2003/077295A1 |
A method for making thin and dicing a substrate while preventing chipping or cracking. The method for dicing a substrate is characterized by comprising a step for forming a reformed region including a region subjected to melting through ...
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WO/2003/074222A1 |
The invention relates to an operating method and to a trolley (20) for a system used for machining objects by using laser beams, particularly for a system used for boring or structuring substrates. The system has a greater number of slow...
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WO/2003/074224A1 |
The invention relates to a laser machining method for rapidly drilling holes in dielectric substrates (6). A Q-switched CO2 laser is used as a laser light source whereby generating a pulsed laser beam (4) with a pulse repetition frequenc...
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WO/2003/073810A1 |
When boring holes in an electrical circuit substrate, a laser beam (4) is moved in concentric orbits in the region of the hole to be bored. According to the invention, the transition from one orbit (K1 to K5) to the next is respectively ...
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WO2003052890B1 |
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is...
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WO/2003/072289A2 |
The invention relates to a method of producing packaging, comprising a step involving the assembly of at least two metallic parts. The inventive method is characterised in that said two parts are assembled by means of brazing.
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WO/2003/073478A2 |
We have discovered a method of producing a complex-shaped aluminum alloy article, where welding has been employed to form the article, where an anodized aluminum coating is produced over a surface of the article including the weld joint,...
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WO/2003/070994A2 |
A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at leas...
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WO/2003/065420A2 |
The invention relates to a method for producing a semiconductor element, especially a thin-layered element. According to the invention, a semi-conductive layer is separated from a substrate by radiation from a laser beam having a plateau...
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WO/2003/061891A2 |
A method and apparatus is disclosed for producing precision marks (28) for a metrological scale in the form of a stainless steel ribbon (10). A laser (21) is used to produce ultra−short pulses, which have a fluence at the ribbon such t...
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WO/2003/062485A1 |
The invention relates to a method for coating a metal surface, such as the surface of liquid flow tubes (3) used in cooling radiators and heat exchangers, with a thin layer of material containing metal. In the method, the material (6) in...
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WO/2003/061892A1 |
Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven. A flux management system includes a cooling chamber having a cooling medium through which the gas passes. The vaporize...
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WO/2003/059568A1 |
An fast steering mirror (30) , such as a PMN actuated mirror, is positioned in a beam path (18) of a stage-based positioning system (40) to continuously move a laser beam (46) in a high speed prescribed pattern about a nominal target pos...
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WO/2003/056592A1 |
Solder ring (12) for joining two components (10, 11) of a vacuum tube, the solder ring (12) comprising a joining part that consists of solder material for forming an airtight joint between the two components. The solder ring (12) further...
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WO/2003/055636A1 |
The invention relates to a laser ablation method for patterning thin film layers for thick dielectric electroluminescent displays without substantial ablation of or damage to any other layers. Typically, the thin film layers are phosphor...
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WO/2003/053627A1 |
A method of laser machining a fluid slot (126) includes directing a UV laser beam towards a substrate with microelectronics to form a slot through the substrate.
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WO/2003/047783A1 |
The invention relates to a method for changing sets of rolls consisting of top rolls, lateral rolls, and a bottom roll, and mounted in chocks of a welding stand of a continuously operating longitudinal tube welding machine. The inventive...
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WO/2003/045616A1 |
The present invention is an automated wire harness machine (40) capable of manufacturing a wire harness (42) unique in-part due to the automation process. The novel wire harness is generally a plurality of bundled, preferably un-stripped...
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WO/2003/043775A1 |
Method for joining components of metals and alloys, particularly components of light metals, including alloys of light metals and possibly hybrids&sol composites containing light metals. Oxide on the surfaces to be joined is removed imme...
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WO/2003/043771A1 |
The invention concerns a method for arc-welding of at least a metal workpiece (1) on a matrix (2) comprising at least a brazed zone (3) whereof the brazing contains copper and phosphorus, which comprises the following steps: (a) producin...
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WO/2003/043774A1 |
A wire bonder for bonding an insulated wire (100) to a surface (110) is disclosed. The bonder includes a bond head (106, 114), having a bonding position adjacent to said surface (100) and a wire preparation position spaced apart from the...
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WO/2003/043779A1 |
The invention relates to a method for manufacturing a stator component or rotor component (10), at least one ring element (3). A joining material is provided in contact with at least one of the blade (2) and the ring element (3). The bla...
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WO/2003/037559A1 |
A process of making a shaped product consisting of aluminium or an aluminium alloy comprising the steps of producing an intermediate object by extrusion or rolling and having at least one flat surface, coating the at least one flat surfa...
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WO/2003/033200A1 |
A method of forming clad piping or tubing (32)includes the steps of providing a support billet (2), finished to a desired, predetermined dimension, having a cladding surface (4), and providing a CRA cladding material billet (7), similarl...
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WO/2003/031111A1 |
The invention concerns a method for overlapping welding of two coated metal sheets (1, 2) with a beam of high energy density (11), characterized in that it consists in splitting the beam (11) into a first sub-beam (12) passing through bo...
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WO/2003/031112A1 |
The invention relates to a pore-free welded connection and to a method for the production of one such welded connection between a first, second and third component (1, 3, 5, 13, 15, 17) which are linked to each other by meals of a closed...
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WO/2003/028949A2 |
A formation (3) in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material (5) is removed from a second surface of th...
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WO/2003/028942A1 |
A laser machining apparatus for machining a work (19) by a laser beam of a uniform intensity distribution by converting the intensity distribution of a CO2 laser beam (11) into a uniform intensity distribution by means of an intensity co...
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WO/2003/028932A1 |
A processing device, a processing method, and production equipment using the device and the method capable of locally heating a work at a high speed and being applied to a soldering connection, the device comprising a light source (1) ge...
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WO/2003/026367A1 |
The invention concerns a method for drilling holes in a circuit substrate (6) with a laser beam, using a perforated mask (8). According to said method, the laser beam (2) is displaced, in the zone of the perforated mask hole (10), along ...
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WO/2003/026369A1 |
A method of forming a hermetically sealed MEMS package (10) includes a step of providing a supporting GaAs substrate (12) with at least one contact (17, 18) for the MEMS device (10) on the surface of the supporting substrate (12) and for...
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WO/2003/022511A1 |
The invention concerns a hybrid arc-laser method for welding one or several metal parts to be welded, such as the edges of a tube or tailored blanks by producing a weld joint between the edges to be welded, said weld joint being obtained...
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WO2002073322B1 |
A quasi-CW diode- or lamp-pumped, A-O Q-switched solid-state UV laser system (10) synchronizes timing of the quasi-CW pumping with movement of the positioning system (36) to reduce pumping while the positioning system (36) is moving from...
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