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WO/2000/048784A1 |
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low mel...
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WO/2000/044522A1 |
The invention relates to a metal foil connection (1) between a first (2) and a second (3) metal foil, where the first (2) and the second (3) metal foil both have a thickness of less than 0.05 mm and are soldered together at a connection ...
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WO/2000/041839A1 |
As many beam distributing/shaping devices (21a, 21b) as the number of heads (7a, 7b) are disposed in series on an optical path of a laser beam (2) emitted from a laser oscillator (1). Then, the devices (21a, 21b) are operated to supply a...
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WO/2000/042472A1 |
Patterned articles, such as RFID antennas, are made by subablation, a process comprising the steps of: A. providing a substrate having a coating, such as a metal or metal oxide, and an interface comprising the thin region where the coati...
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WO/2000/042464A1 |
A package (10) for optical components (16, 18, 22) and a method for making the package are disclosed. The package (10) comprises a quasi-planar substrate (12) having a positioning floor (14), a platform (20), and an optional ring frame (...
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WO/2000/041834A1 |
The invention relates to a method and a device for thermally connecting the contact surfaces (26, 27) of a contact substrate (11) comprising contact surfaces (28, 29) of a carrier substrate (12). The substrates (11, 12) are arranged in a...
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WO/2000/038871A1 |
A welding apparatus, for welding pipe sections (1, 2) together to form an underwater pipeline, is arranged to weld pipe sections (1, 2) together when they are in a generally upright orientation with the bottom of an upper pipe section (2...
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WO/2000/030800A1 |
A method and apparatus for ablating features in a substrate, the apparatus including a radiation source and first and second rotating transparent uniformly thick disks positioned between the radiation source and a substrate to be irradia...
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WO2000020154A9 |
An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform (112) to support the substrate at a first sphere placement position in the apparatus, and a placement station (107) disposed ab...
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WO/2000/030799A1 |
This invention concerns a process useful for ablating features from a substrate, including the steps of illuminating the substrate with laser light that has passed through a mask to form an ablated feature in the substrate, wherein the m...
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WO/2000/029800A1 |
An automotive heat exchanger that includes a manifold (12) and a mounting block (10) attached to the manifold (12) and over an opening (30) in the wall of the manifold (12). The mounting block (10) has a flange portion (16) with a surfac...
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WO/2000/029801A1 |
A heat exchanger member (12) having an internal passage in which a baffle assembly (14) is received to define at least two separate flow regions within the passage. The baffle assembly (14) includes a pair of baffles (18, 26), a first (1...
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WO2000003832A9 |
A portion (118) or component (116) of a metal container (112) is provided with markings (114) or indicia using laser light (218). High-speed laser steering is used to position laser light or laser light pulses across a lateral and longit...
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WO/2000/025971A1 |
The present invention relates to an apparatus and a method for inerting a wave soldering installation having a solder bath (19) and a conveying system for producing one or more solder waves (14, 15), in particular for soldering electric ...
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WO/2000/015578A1 |
The invention concerns the assembling of a first element comprising aluminium nitride and a second metal or metal alloy element, wherein the interface between the two elements comprises at least a simple or complex rare earth, scandium a...
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WO/2000/011921A1 |
The invention relates to a method and a device for placing a plurality of shaped pieces (20) consisting of solder material on a connecting surface arrangement (29) of a substrate (23) having a plurality of connecting surfaces (28) and fo...
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WO/2000/003831A1 |
According to the invention, a workpiece (3) embodied, for example, as a printed circuit board, is displaced between two laser units (2) which emit laser beams that are directed towards each other. In this way two sides of the workpiece (...
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WO/2000/003830A1 |
According to the invention, a workpiece (1) embodied, for example, as a printed circuit board by means of a transport device (6) can be displaced beneath a laser unit (3) in such a way that a workpiece (1) area (8) to be processed is mov...
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WO/2000/003829A1 |
An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with...
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WO/2000/003845A2 |
According to the invention, two housings (5) which are guided in the X and Y axes and designed for receiving workpieces (6) can be displaced independently of each other and according to an alternating, cyclic sequence of movements in a s...
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WO/2000/002292A1 |
A laser polarization control apparatus includes a polarization modifying device (24), such as a liquid crystal variable retarder, and a controller (18). The polarization modifying device receives a laser beam (12) and modifies the polari...
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WO/1999/067041A1 |
The invention refers to a method of joining at least four heat transfer plates (2) to a plate package for a plate heat exchanger. Each heat transfer plate (2) comprises an outer edge portion (10) extending around the heat transfer plate ...
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WO/1999/063795A1 |
According to the invention, the conductor pattern is configured such that the connection pads (P1) are respectively connected via a conductor region with a reduced width (LB1) to the conductor tabs (LZ) which extend the conductor. A sold...
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WO/1999/063793A1 |
This invention applies to the use of shaped beams of laser radiation for increasing the maximum speed of tools used to laser drill microvia holes in PCB's, PWB's and other electrical circuit packages. With an annular spatial intensity di...
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WO/1999/062310A1 |
This invention relates to using mid-infrared high-power pulsed laser radiation sources for drilling high-quality microvia interconnection holes in printed circuit (wiring) boards and other electrical circuit packages.
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WO/1999/060323A1 |
An aluminum alloy composition consists essentially of controlled amounts of iron, silicon, copper, manganese, magnesium, titanium, zinc, zirconium and free machining elements with the balance being aluminum and incidental impurities. The...
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WO/1999/057501A1 |
A method for enhancing the brazeability of a heat exchanger manifold block (110) by promoting the braze metal flow in and around the manifold block (110) during brazing within a braze furnace. The invention is particularly directed to en...
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WO/1999/054081A1 |
A method of fabricating a corrosion resistant enclosure for a radioactive material container, the method comprising friction stir welding at least two sections (1, 2) of copper or a copper alloy material together.
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WO/1999/044783A1 |
During manufacture of certain hollow profiles suitable for use in car body construction the welded profiles are subjected to a further deformation process, namely hydroforming. At present the corresponding welding machines are charged ma...
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WO/1998/057774A1 |
The invention relates to a method for repairing defective soldered joints. According to said method, in a first step a solder handling device (12) with a solder removal device is placed at the level of a defective soldered joint and a de...
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WO/1998/038001A1 |
A laser via drilling system, and method of operation thereof, operates at an increased pulse repetition rate, but provides output pulses of sufficient energy and consistent pulse to pulse energy. In order to drill a via hole in a substra...
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WO/1998/020538A1 |
A method for forming a through-via in a laminated substrate by laser drilling a through-via from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are spaced at a f...
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WO/1998/020534A1 |
A method of making a laminated substrate by forming a registration mark on a core layer of the substrate. Then, forming a first layer on the core layer using the registration mark as a fiducial registration point. The first layer is lase...
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WO/1998/016786A1 |
The module is formed of two mutually laser welded sheet metals (1, 2). Longitudinal weld seams (6) define between them longitudinal conduits (32) for the circulation of a first fluid. The metal sheets (1, 2) are also assembled by a perip...
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WO/1998/003271A1 |
The present invention involves in situ laser patterning of thin-film layer during sequential deposition of different layers, and laser ablation to remove unwanted portions of the layers, including color filter materials sequentially depo...
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WO/1997/044155A1 |
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in targets (40) having metallic layers (64, 68) and a dielectric layer (66). The invent...
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WO/1997/041980A1 |
The invention relates to an arrangement for producing expanded material (8), in particular sheet-like metal webs (2). Said arrangement has cutting means (3) for producing contiguous strips from sheet webs (5), and means (6, 7) for expand...
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WO/1997/035683A1 |
The proposal is for a process for soldering wound or layered structures of at least partially structured sheet-metal layers (2, 3), especially honeycombs for exhaust gas catalysts. In this process a solder (16) and an especially particul...
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WO/1997/034732A1 |
The disclosure relates to an amorphous alloy with a composition given by the formula BAa - KOb - GLc - ZUd, wherein BA stands for the basic elements Ni, Fe and optionally Co, the proportion of iron Fex in the alloy being such that 7 x 20...
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WO/1997/029878A1 |
A cutting die (13, 14) is made by milling the blade (14) shapes in a die (13) surface and then scanning the blades (14) with a laser (10) beam or other high energy beam or induction field to heat and then harden the blades (14). To minim...
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WO/1997/001868A1 |
A method of manufacturing a plurality of multilayer electronic components, comprising the steps of: (a) manufacturing a laminated sheet (1) in which layers (3, 3') of ceramic tape are each provided on one side with a pattern of electrode...
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WO/1996/034717A1 |
A welded pipe obtained by liquid-phase diffusion welding of pipes with an intermediate insert having a lower melting point than the pipes, wherein the joint has an increased outer diameter and a decreased inner diameter. A pipe welding m...
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WO/1996/026805A1 |
The invention concerns a honeycombed body, in particular for a device for the catalytic conversion of exhaust gases in an exhaust gas system, in particular for the exhaust gas system of an internal combustion engine, preferably for spark...
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WO/1996/012830A1 |
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for plating internal wall surfaces (79, 126) of vias (72, 74) in multi-layered electronic devices (80). The param...
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WO/1996/011080A1 |
A work butt position detecting method for detecting with a high accuracy the butt position of works having even chamfered edges or sags at the ends thereof. Works (1, 2) are scanned with a light beam (52) across a weld line (4), and the ...
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WO/1996/008336A1 |
A method for manufacturing metallic structures, in particular honeycombed bodies, especially for catalytic converters, from at least partially structured, wound up, intertwined or layered sheet metal layers, comprises the following steps...
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WO/1996/002351A1 |
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to...
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WO/1995/030508A1 |
The description relates to a process for soldering metal structures, especially honeycomb bodies for exhaust gas catalysts. Here, the solder is applied in powder form and bonded to the metal structure by a bonding agent acting as an adhe...
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WO/1995/020455A1 |
Two steel U-shaped half-section pipes (4, 5) are joined by a steel ribbed web (2) with rectangular folds. Soldering foil (23) is placed between the ridge regions (21, 22) of the ribbed web (2) and the outer surfaces (3) of the half secti...
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WO/1995/006541A1 |
A laser welder (10) is provided comprising an optical fiber (28), a wheel (26) including a slot for receiving an article to be welded, the optical fiber mounted to and wound upon the wheel (26) as the wheel is rotated to bring the fiber ...
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